Product support 5 min read

M470 Scanning Electrochemical Workstation Software

The Scanning Electrochemical Workstation software provides unique capabilities and interactivity in support of the  Model 470 nanometer-resolution scanning probe microscope. This highly ergonomic software has been designed to facilitate and improve the user experience and to improve the efficiency of workflows:


  • Improved data analysis, manipulation and interactivity
  •  Automatic measurement and sequencing functionalities.


Over 40 discrete experiments provided throughout, each with their own individual variations such as:

  • Height-Tracking (above surface)
  • Surface-Tracking (on surface)
  • Step Scan
  • Sweep Scan
  • Pre-Delays, Line-Delays, Velocities, Step Sizes, Scan Dimensions, Signal Conditioning Parameters, Control Loop Parameters, Potentiostat Setting etc.


The Software provides both 64 bit WindowsTM support in a standard Multiple Document Interface (MDI) application that supports all standard WindowsTM features.

The Software is completely self-contained in a single application and contains:



• Electrochemistry suite (EChem)
• Corrosion suite (ECorr)
• Scanning Electrochemical Microscopy (SECM)
• alternating-current Scanning Electrochemical Microscopy (ac-SECM)
• intermittent-contact Scanning Electrochemical Microscopy (ic-SECM)
• combined ic-ac Scanning Electrochemical Microscopy (ic-ac-SECM)
• Scanning Vibrating Electrode (SVET)
• Scanning Kelvin Probe (SKP)
• Capacitive Height Measurement/Tracking  (CHM / CTM)
• Localized Electrochemical Impedance Spectroscopy  (LEIS)
• Scanning Droplet System / Cell  (SDS / SDC)
• alternating-current Scanning Droplet System/ Cell  (ac-SDS / ac-SDC)
• Non-contact Optical Surface Profiling (Laser based)  (OSP)




  • Experiment Sequencing.
  • Multiple views of the same data presented in different formats or presentations.
  • User-definable presentations of the data through a simple template-design tool.
  • Fully programmable macro language for non-standard experiments.
  • Relieve sample topography in area maps using “Height Tracking” from any topography data source: CHM, CTM, OSP, and ic-SECM.
  • Direct real-time readout of displacement in x, y and z.
  • Surface maps acquired at up to 70,000 data points in each axis.
  • Simultaneous acquisition of multiple parameters at each point; 1 scan = many maps.
  • Up to 12 different area maps populated simultaneously in a single scan, with 4 additional maps reserved for users’ data analysis.
  • Application preferences for current convention.
  • Application preferences for graph visuals.



2D & 3D analysis tools


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Version history

M470sw v1.50 (online Sept. 12, 2022)

• Addition of SDS peristaltic pump control
• Addition of SECM Approach Curve Topography Extrapolation Experiment
• Help files have been updated to include these additions
• Issues with 100 pA/V current range have been resolved
• The height tracking option has been unlocked for the LEIS area scan

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